Modeling and thermal analysis of micro beam using COMSOL multiphysics

In this study, the design and analysis of micro beam is carried out using COMSOL multiphysics. The current passing through distributes heat energy due to its resistance that pushes entire desired distance thermal expansion. This expansion varies depending on amount emitted temperature. purpose model created estimate temperature increase required cause displacement in proposed software. addition, displacements data produced beams for different metallic materials (Al, Cu, Ni, Pt) input potentials (0.3 V, 0.6 0.9 V) are reported. These used as functional field micro-electro-mechanical-system because their important physical electrical properties. As a result simulation studies, increasing voltage increased resulting While there serious difference between materials, temperatures close each other. When V applied, highest values Al, Pt are; 7.88 ?m, 5.36 3.62 2.72 respectively. result, it has been observed aluminum gives significant dis?placement geometry when compared other beams.